The T-series photoresist is designed to meet the requirements of advanced device fabrication, such as MEMS, Lithography, microfluidic, integrated circuit, bumping RDL (Redistribution Layer, 2/2um) / TSV (Through Silicon Via) process applications.
Photoresists remover is an NMP- / DMSO- / Non-NMP- / Non-DMSO- based mixture, and a ready-to-use standard remover for widely existing positive photoresist removing. In addition, it’s formulated for widely sensitive substrates use. It can be used in either wet bench or spray tool applications.
Deflashing chemical common applied to described the removal of excess mold flash or mold bleed as a results of molding process.
Dicing Fluid, semiconductor lubricants represent the best technology for your wafer dicing needs. Our products are specifically designed to enhance lubrication, prevent galvanic corrosion, dissipate heat and eliminate topside and bottom side chipping in a clean and effective way. Both our chemical and centralized dispensing equipment are specially designed to be environmental friendly, as well as a robust and easy to use technology.
Laser Grooving Surfactant, semiconductor lubricants represent the best technology for your wafer dicing needs.
FS-series semi-aqueous solvent formulation to remove hard flux and paste residues from wafer bump found in semiconductor post-assemblies procedure. It is compatible with all soldering materials and metal layers.