PTFE / ETFE film products with excellent heat resistance, releasability, and flexibility. By using it as a mold release film in the resin encapsulation process of semiconductor chips, it helps reducing frequency of cleaning molds, the amount of solvent used, and extending the life of molds.
•Can be customized on customer’s requirement.
•To prevention of mold tool contamination from material such as Si and Epoxy, can be used at high temp. > 180oC.
• Reducing the wrinkle at high temp. and the mold flash is prevented.
•Excellent releasing, no residue in cavity after detailing.
