Hub Dicing Blades
Hub blades for advanced semiconductor & package dicing. For silicon, copper & low-k metallised wafers. Bevel-series blades for LED dicing. New uni-plus series for package dicing.
Hub blades for advanced semiconductor & package dicing. For silicon, copper & low-k metallised wafers. Bevel-series blades for LED dicing. New uni-plus series for package dicing.